Isku-xidhka Crystal- Farsamada Isku-dhafka ah ee Crystals Laser
Sharaxaada Alaabta
Muhiimadda codsiga tignoolajiyada isku-xidhka ee kiristaalo laser waxay ku jirtaa: 1.Miniaturization iyo is-dhexgalka aaladaha / nidaamyada laser, sida Nd: YAG / Cr: YAG bonding ee soo saarista lasers-ka ee Q-switched microchip; 2. Hagaajinta xasiloonida kulaylka ee ulaha laysarka Waxqabadka, sida YAG/Nd:YAG/YAG (taas oo ah, ku xidhan YAG saafi ah si loo sameeyo waxa loogu yeero "koofida dhamaadka" ee labada daraf ee usha laysarka) waxay si weyn u yarayn kartaa kor u kaca heerkulka wajiga dhamaadka Nd: ul YAG marka ay shaqaynayso, inta badan loo isticmaalo semiconductor bamgareynta lasers-state adag iyo leysarka-state adag oo u baahan hawl awood sare.
Shirkaddayada YAG taxanaha ugu weyn ee alaabada crystal bonded waxaa ka mid ah: Nd: YAG iyo Cr4+: YAG bonded ulo, Nd: YAG bonded YAG saafi ah labada daraf, Yb: YAG iyo Cr4+: YAG bonded ulo, iwm .; dhexroor ka Φ3 ~ 15mm, dhererka ( dhumucdiisuna) laga bilaabo 0.5 ~ 120mm, sidoo kale waxaa laga baaraandegi karaa galay strips square ama go'yaal laba jibbaaran.
crystal bonded waa shey isku daraya crystal laser leh hal ama laba maaddooyinka substrate-ka isku midka ah ee saafiga ah iyada oo loo marayo tignoolajiyada isku xidhka si loo gaaro isku darka xasilloon. Tijaabooyinku waxay muujinayaan in kiristaalo-ku-xidhka ay si wax ku ool ah u yareeyn karaan heerkulka kiristaalo laysarka oo ay yareeyaan saamaynta saamaynta lenska kulaylka ee ay keento qallafsanaanta wejiga dhamaadka.
Astaamaha
● Lensiga kulaylka oo yaraada oo ay sababto qallafsanaanta wejiga dhamaadka
● Waxtarka iftiinka-ilaashka oo la hagaajiyay
● Kordhinta iska caabbinta heerka waxyeelada sawirka
● tayada wax soo saarka laysarka oo la hagaajiyay
● Tirada la dhimay
Fiican | <λ/10@632.8nm |
Tayada dusha sare | 10/5 |
Isbarbar yaac | <10 ilbiriqsi |
Toosannimada | <5 daqiiqo |
Chamfer | 0.1mm@45° |
lakabka dahaarka | dahaarka AR ama HR |
Tayada indhaha | Fargelinta faragelinta: ≤ 0.125/inch Faragelinta faragelinta: ≤ 0.125/inch |